JPH0541617Y2 - - Google Patents
Info
- Publication number
- JPH0541617Y2 JPH0541617Y2 JP3868289U JP3868289U JPH0541617Y2 JP H0541617 Y2 JPH0541617 Y2 JP H0541617Y2 JP 3868289 U JP3868289 U JP 3868289U JP 3868289 U JP3868289 U JP 3868289U JP H0541617 Y2 JPH0541617 Y2 JP H0541617Y2
- Authority
- JP
- Japan
- Prior art keywords
- inner case
- recess
- adhesive
- groove
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 19
- 238000004382 potting Methods 0.000 description 13
- 229910052742 iron Inorganic materials 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3868289U JPH0541617Y2 (en]) | 1989-03-31 | 1989-03-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3868289U JPH0541617Y2 (en]) | 1989-03-31 | 1989-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02129825U JPH02129825U (en]) | 1990-10-25 |
JPH0541617Y2 true JPH0541617Y2 (en]) | 1993-10-21 |
Family
ID=31546909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3868289U Expired - Lifetime JPH0541617Y2 (en]) | 1989-03-31 | 1989-03-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0541617Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6577693B2 (ja) * | 2013-10-09 | 2019-09-18 | パナソニック デバイスSunx竜野株式会社 | 表示装置 |
-
1989
- 1989-03-31 JP JP3868289U patent/JPH0541617Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02129825U (en]) | 1990-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6590999B1 (ja) | 防水型電子機器および防水型電子機器の製造方法 | |
JP4107347B2 (ja) | 赤外線センサおよび赤外線センサの製造方法 | |
US7095123B2 (en) | Sensor semiconductor package, provided with an insert, and method for making same | |
KR19990029874A (ko) | 반도체 광 센서 디바이스 | |
US8168896B2 (en) | Electronic housing | |
KR100315833B1 (ko) | 자기식회전수센서 | |
JP2003258454A (ja) | 箱形制御ユニット | |
JPH06331477A (ja) | プラスチックケーシング内の圧力センサ及び該圧力センサを製造する方法 | |
JPH0541617Y2 (en]) | ||
JPH09159525A (ja) | 赤外線センサ | |
JP3427523B2 (ja) | パッケージ構造 | |
JPH07226135A (ja) | 検出スイッチ | |
JP2575883Y2 (ja) | 車載用外装ケースの防水構造 | |
JP2511984B2 (ja) | 電子回路の収容ケ−ス | |
JP3127056B2 (ja) | マイクロセンサ | |
JP2841738B2 (ja) | 圧力検出素子のパッケージ構造 | |
EP0861019A1 (fr) | Boítier de protection pour circuit électronique | |
JPH0653454A (ja) | イメージセンサのガラスキャップ封止構造 | |
JPH10299902A (ja) | シール方法 | |
JPH0514522Y2 (en]) | ||
JPS63163248A (ja) | 半導体圧力センサ | |
JPS5869174A (ja) | 固体撮像装置 | |
JPH0342706Y2 (en]) | ||
JPH0132788Y2 (en]) | ||
JPH0458548A (ja) | ハイブリッドicモジュール |